document number: 94058 for technical ques tions within your region, please cont act one of the following: www.vishay.com revision: 24-may-11 diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com 1 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 hexfred ? ultrafast soft recovery diode, 2 x 8 a vs-hfa16ta60cpbf vishay semiconductors features ? ultrafast and ultrasoft recovery ? very low i rrm and q rr ? compliant to rohs directive 2002/95/ec ? designed and qualified for industrial level benefits ? reduced rfi and emi ? reduced power loss in diode and switching transistor ? higher frequency operation ? reduced snubbing ? reduced parts count description vs-hfa16ta60cpbf is a state of the art center tap ultrafast recovery diode. employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available. with basi c ratings of 600 v and 8 a per leg continuous current, the vs-hfa16ta60cpbf is especially well suited for use as the companion diode for igbts and mosfets. in addition to ultrafast recovery time, the hexfred ? product line features extremely low values of peak recovery current (i rrm ) and does not exhibit any tendency to snap-off during the t b portion of recovery. the hexfred features combine to offer designers a rectifier with lower noise and signific antly lower switching losses in both the diode and the switching transistor. these hexfred advantages can help to significantly reduce snubbing, component count and heatsink sizes. the hexfred vs-hfa16ta60cpbf is ideally suited for applications in power supp lies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed. product summary package to-220ab i f(av) 2 x 8 a v r 600 v v f at i f 1.7 v t rr (typ.) 18 ns t j max. 150 c diode variation common cathode to-220ab anode 13 2 base common cathode 2 common cathode anode absolute maximum ratings parameter symbol test conditions values units cathode to anode voltage v r 600 v maximum continuous forward current per leg i f t c = 100 c 8 a per device 16 single pulse forward current i fsm 60 maximum repetitive forward current i frm 24 maximum power dissipation p d t c = 25 c 36 w t c = 100 c 14 operating junction and storage temperature range t j , t stg - 55 to + 150 c
www.vishay.com for technical qu estions within your region, please contact one of the fo llowing: document number: 94058 2 diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com revision: 24-may-11 this document is subject to change without notice. the products described herein and this document ar e subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vs-hfa16ta60cpbf vishay semiconductors hexfred ? ultrafast soft reco very diode, 2 x 8 a electrical specifications per leg (t j = 25 c unless otherwise specified) parameter symbol test conditio ns min. typ. max. units cathode to anode breakdown voltage v br i r = 100 a 600 - - v maximum forward voltage v fm i f = 8 a see fig. 1 -1.41.7 i f = 16 a - 1.7 2.1 i f = 8 a, t j = 125 c - 1.4 1.7 maximum reverse leakage current i rm v r = v r rated see fig. 2 -0.35.0 a t j = 125 c, v r = 0.8 x v r rated - 100 500 junction capacitance c t v r = 200 v see fig. 3 - 10 25 pf series inductance l s measured lead to lead 5 mm from package body -8.0-nh dynamic recovery characteristics per leg (t j = 25 c unless otherwise specified) parameter symbol test conditio ns min. typ. max. units reverse recovery time see fig. 5 and 10 t rr i f = 1.0 a, di f /dt = 200 a/s, v r = 30 v - 18 - ns t rr1 t j = 25 c i f = 8.0 a di f /dt = 200 a/s v r = 200 v -3755 t rr2 t j = 125 c - 55 90 peak recovery current see fig. 6 i rrm1 t j = 25 c - 3.5 5.0 a i rrm2 t j = 125 c - 4.5 8.0 reverse recovery charge see fig. 7 q rr1 t j = 25 c - 65 138 nc q rr2 t j = 125 c - 124 360 peak rate of fall recovery current during t b see fig. 8 di (rec)m /dt1 t j = 25 c - 240 - a/s di (rec)m /dt2 t j = 125 c - 210 - thermal - mechanical specifications per leg parameter symbol test conditio ns min. typ. max. units lead temperature t lead 0.063" from case (1.6 mm) for 10 s - - 300 c junction to case, single leg conducting r thjc --3.5 k/w junction to case, both legs conducting - - 1.75 thermal resistance, junction to ambient r thja typical socket mount - - 80 thermal resistance, case to heatsink r thcs mounting surface, flat, smooth and greased - 0.5 - weight -2.0- g -0.07- oz. mounting torque 6.0 (5.0) - 12 (10) kgf cm (lbf in) marking device case st yle to-220ab hfa16ta60c
document number: 94058 for technical ques tions within your region, please cont act one of the following: www.vishay.com revision: 24-may-11 diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com 3 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vs-hfa16ta60cpbf hexfred ? ultrafast soft reco very diode, 2 x 8 a vishay semiconductors fig. 1 - maximum forward voltage drop vs. instantaneous forward current (per leg) fig. 2 - typical reverse current vs. reverse voltage (per leg) fig. 3 - typical junc tion capaci tance vs. reverse voltage (per leg) fig. 4 - maximum thermal impedance z thjc characteristics (per leg) 94058_01 v fm - forward voltage drop (v) 0.4 0.1 1 100 0.8 1.2 1.6 2.0 2.4 2.8 3.2 i f - instantaneous forward current (a) 10 t j = 150 c t j = 125 c t j = 25 c 0 v r - reverse voltage (v) i r - reverse current (a) 100 300 200 0.01 0.001 94058_02 0.1 1 10 100 400 500 a 1000 600 t j = 25 c t j = 125 c t j = 150 c 100 10 100 1000 v r - reverse voltage (v) c t - junction capacitance (pf) 94058_03 a t j = 25 c 10 1 1 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 t 1 - rectangular pulse duration (s) z thjc - thermal response 0.01 notes: 1. duty factor d = t 1 /t 2 2. peak t j = p dm x z thjc + t c d = 0.50 d = 0.20 d = 0.10 d = 0.05 d = 0.02 d = 0.01 single pulse (thermal response) 2 t 1 t p dm
www.vishay.com for technical qu estions within your region, please contact one of the fo llowing: document number: 94058 4 diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com revision: 24-may-11 this document is subject to change without notice. the products described herein and this document ar e subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vs-hfa16ta60cpbf vishay semiconductors hexfred ? ultrafast soft reco very diode, 2 x 8 a fig. 5 - typical reverse recovery time vs. di f /dt (per leg) fig. 6 - typical recovery current vs. di f /dt (per leg) fig. 7 - typical stored charge vs. di f /dt (per leg) fig. 8 - typical di (rec)m /dt vs. di f /dt (per leg) 0 100 1000 di f /dt (a/s) t rr (ns) 20 60 40 80 94058_05 i f = 16 a i f = 8.0 a i f = 4.0 a v r = 200 v t j = 125 c t j = 25 c 0 100 1000 di f /dt (a/s) i rr (a) 4 12 8 16 94058_06 20 i f = 16 a i f = 8.0 a i f = 4.0 a v r = 200 v t j = 125 c t j = 25 c 0 100 1000 di f /dt (a/s) q rr (nc) 100 300 200 400 94058_07 500 i f = 16 a i f = 8.0 a i f = 4.0 a v r = 200 v t j = 125 c t j = 25 c 100 100 1000 di f /dt (a/s) 1000 10 000 i f = 16 a i f = 8.0 a i f = 4.0 a di (rec)m /dt (a/s) v r = 200 v t j = 125 c t j = 25 c
document number: 94058 for technical ques tions within your region, please cont act one of the following: www.vishay.com revision: 24-may-11 diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com 5 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vs-hfa16ta60cpbf hexfred ? ultrafast soft reco very diode, 2 x 8 a vishay semiconductors fig. 9 - reverse recovery parameter test circuit fig. 10 - reverse recovery waveform and definitions irfp250 d.u.t. l = 70 h v r = 200 v 0.01 g d s di f /dt adju s t q rr 0.5 i rrm di (rec)m /dt 0.75 i rrm i rrm t rr t b t a i f di f /dt 0 (1) (2) (3) (4) (5) (1) di f /dt - rate of change of current through zero cro ss ing (2) i rrm - peak rever s e recovery current (3) t rr - rever s e recovery time mea s ured from zero cro ss ing point of negative going i f to point where a line pa ss ing through 0.75 i rrm and 0.50 i rrm extrapolated to zero current. (4) q rr - area under curve dened by t rr and i rrm t rr x i rrm 2 q rr = (5) di (rec)m /dt - peak rate of change of current during t b portion of t rr
www.vishay.com for technical qu estions within your region, please contact one of the fo llowing: document number: 94058 6 diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com revision: 24-may-11 this document is subject to change without notice. the products described herein and this document ar e subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vs-hfa16ta60cpbf vishay semiconductors hexfred ? ultrafast soft reco very diode, 2 x 8 a ordering information table links to related documents dimensions www.vishay.com/doc?95222 part marking information www.vishay.com/doc?95225 2 - hexfred ? family 4 - current rating (16 = 16 a) 4 5 - package: 4 ta = to-220ab 3 - electron irradiated 6 7 - voltage rating (60 = 600 v) 1 - vishay semiconductors product - circuit configuration: c = common cathode 8 tube standard pack quantity: 50 pieces - pbf = lead (pb)-free device code 5 1 3 2 4 6 7 8 vs- hf a 16 ta 60 c pbf
document number: 95222 for technical ques tions within your region, please cont act one of the following: www.vishay.com revision: 08-mar-11 diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com 1 to-220ab outline dimensions vishay semiconductors dimensions in millimeters and inches notes (1) dimensioning and tolerancin g as per asme y14.5m-1994 (2) lead dimension and fini sh uncontrolled in l1 (3) dimension d, d1 and e do not in clude mold flash. mold flash shall not exceed 0.127 mm (0.005" ) per side. these dimensions are measured at the outermost extremes of th e plastic body (4) dimension b1, b3 and c1 apply to base metal only (5) controlling dimensions: inches (6) thermal pad contour optional within dimensions e, h1, d2 and e1 (7) dimensions e2 x h1 define a zone where stamping and singulation irregularities are allowed (8) outline conforms to jedec to- 220, except a2 (maximum) and d2 (minimum) where dimensions are derived from the actual package outline symbol millimeters inches notes symbol millimeters inches notes min. max. min. max. min. max. min. max. a 4.25 4.65 0.167 0.183 e 10.11 10.51 0.398 0.414 3, 6 a1 1.14 1.40 0.045 0.055 e1 6.86 8.89 0.270 0.350 6 a2 2.56 2.92 0.101 0.115 e2 - 0.76 - 0.030 7 b 0.69 1.01 0.027 0.040 e 2.41 2.67 0.095 0.105 b1 0.38 0.97 0.015 0.038 4 e1 4.88 5.28 0.192 0.208 b2 1.20 1.73 0.047 0.068 h1 6.09 6.48 0.240 0.255 6, 7 b3 1.14 1.73 0.045 0.068 4 l 13.52 14.02 0.532 0.552 c 0.36 0.61 0.014 0.024 l1 3.32 3.82 0.131 0.150 2 c1 0.36 0.56 0.014 0.022 4 ? p 3.54 3.73 0.139 0.147 d 14.85 15.25 0.585 0.600 3 q 2.60 3.00 0.102 0.118 d1 8.38 9.02 0.330 0.355 ? 90 to 93 90 to 93 d2 11.68 12.88 0.460 0.507 6 13 2 d d1 h1 q 13 2 c c d d 3 x b2 3 x b (b, b2) b1, b3 (h1) d2 detail b c a b l e1 lead tip e e2 ? p 0.014 a b m m 0.015 a b mm s eating plane c a2 a1 a a a lead assignments diode s 1. - anode/open 2. - cathode 3. - anode conforms to jedec outline to-220ab (6) (6) (7) (6) (7) e 2 x l1 (2) detail b s ection c - c and d - d view a - a ba s e metal plating (4) (4) c1 c (6) thermal pad (e) e1 (6)
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